The International Conference on Flexible and Printed Electronics (ICFPE 2024) takes place from August 28-30, 2024, in Taipei, Taiwan. OE-A is a partner of this event and organizes a conference session. The OE-A Asia Meeting will be held one day prior to the ICFPE in Taipei, August 27.
The conference ICFPE is hosted by the National Taipei University of Technology. As a partner of ICFPE, OE-A is organizing a conference session on ‘Flexible and Printed Electronics’. The OE-A session will address a variety of aspects and applications of flexible and printed electronics, such as Artificial Intelligence for Printing, Display Technology, Printing Process and Equipment, Flexible Electronic Materials and Green Energy – just to give a few examples. Dr. Alain Schumacher, CTO of IEE and Vice Chair OE-A, gives a keynote at the conference.
Important Information
Date August 28, 2024
Time 10:40 – 15:00 h
Venue GIS Convention Center, National Taiwan University
Moderator Dr. Klaus Hecker, Managing Director, OE-A
ICFPE Keynote by OE-A Vice Chair Dr. Alain Schumacher, IEE S.A.
Date August 28, 2024
Time 15:30 – 16:30 h
15:30 h Printed Electronics – Enriching Society with Pragmatic Innovation
Dr. Alain Schumacher, CTO, IEE S.A.
Agenda
Flexible and Printed Electronics: A Short Introduction and Outlook
Dr. Klaus Hecker, Managing Director, OE-A (DE)
Upscaling 3rd Gen PV into production tech: Upscaling methology for OPV and Perovskite solar cells
Thomas Kolbusch, Vice President, Coatema (DE), Co-Authors: Harmen Rooms, R&D Project Manager, Coatema (DE),
Regina Reuscher, Project Manager, Coatema (DE)
Inkjet printing of organic Ag for conductive lines
Prof. Dr. Ulrich Moosheimer, Professor for Printing Technology, Hochschule München – Munich University of Applied Sciences (DE)
Co-Author: Alan Paul Stadnik, Manager Inkjet Industrialization, Heraeus Printed Electronics GmbH (DE)
Aerosol-jet printed MXene for flexible electronics
Ta-Ya Chu, Senior Research Officer, National Research Council Canada (CA)
Applications and technologies for connective packaging and product communication – from printed RFID antenna to printed electrochromic displays
Andrea Glawe, Regional Sales Director Asia, KROENERT (DE)
Co Author: Ivy Chen, Founder & CEO, Jerloun Inc. (TW)
Breakthrough: Presenting the next generation of high conductive silver inks
Shawn Mo, Business Development & Application Engineer Manager, Henkel China (CN)
Game-changing AR/VR and e-privacy optical modules made on existing FPD lines
Chuck Milligan, CEO, FlexEnable Technology Ltd (GB)
Product development and manufacturing of custom medical electrodes
Mikko Paakkolanvaara, CTO, Screentec Oy (FI)
Developing Flexible Integrated Circuits through Customized Organic TFTs
Steven Tsai, Head of Technology Transfer, SmartKem Limited (GB)
If you are interested in speaking at the OE-A session, please contact Daria, daria.knoth@oe-a.org
OE-A Meeting Asia, August 27, day before ICFPE
On Tuesday, August 27th, 2024, we plan for a OE-A Meeting Asia in Taipei area including company visits at E Ink, ITRI, AUO and a networking event. Join this opportunity to meet Taiwanese companies active in flexible and printed electronics. More details soon to come.