IMS Chips, Germany
Fully Flexible Sensor-Tag based on IMS CHIPS Chip-Film Patch (CFP) technology.
This project integrates a platinum/nickel resistive temperature sensor and a gold strain-gauge to measure bending state of the foil. Theoretically, any other low power consumption sensor can be integrated in a sensor-tag. The tag measures ambient temperature and the bending state of the foil. All measured data are transmitted to the smartphone, which displays the measured values on the app.
Purpose / Benefits
- The sensor system patch is flexible and bendable: adaptable to variable surface shapes (e.g. on skin)
- The system connects flexible sensors-in-foil with a read-out-circuit: No external measurement gear is necessary. Readout device powers the whole system
- Usage of NFC: any NFC-capable smartphone can be used to gather data
Organic & Printed Components
- Organic dielectric
Target Group
- Consumer Electronics
- Healthcare (e.g. implants)