OE-A and LOPEC will represent Printed Electronics at productronica, November 15 + 16. Printed Electronics Forum at productronica. NEW: Special Printed Electronics Pavilion powered by LOPEC.
This year’s productronica takes place at November 14-17, 2023 in Munich and presents trending topics with highest relevance to the industry. As a partner of productronica OE-A and LOPEC will host free seminars on flexible, organic, and printed electronics. Here OE-A members present their latest developments, future technologies, industry trends and growth markets from the industry’s point of view.
Join the OE-A seminars on Printed Electronics at the Innovation Forum
- Date: Wednesday, November 15, 2023 and Thursday, November 16, 2023
- Time: 14:15 – 16:45 h
- Place: Innovation Forum, Hall B2, Messe Munich
In case of questions regarding the Printed Electronics Forum and speaking opportunities, please contact Daria at email@example.com.
Visit the OE-A booth
Meet us at the joint OE-A & VDMA Productronics exhibition booth at B2.451. Learn more about OE-A, the international network, our various services, and the new OE-A Roadmap at the OE-A booth in hall B2, right next to the Innovation Forum.
Printed Electronics Pavilion powered by LOPEC
Productronica, in collaboration with LOPEC, is proud to present an exclusive exhibition area dedicated to companies involved in flexible and printed electronics solutions and products. The Printed Electronics Pavilion will be located in Hall B2, next to the Innovation Forum and the OE-A booth. In hall B2 is also located the Future Production / Smart Factory Cluster. This specialised cluster includes IT-to-production, Industry 4.0, manufacturing technologies for batteries and electrical energy storage systems, flexible, organic and printed electronics, 3D printing and additive manufacturing.
Exhibitors in the Printed Electronics Pavilion will not only have the opportunity to showcase their offerings, but will also be able to participate in the Printed Electronics Forum. Click here for detailed information on stand packages.