OE-A Meetings

OE-A

Through frequent meetings in Europe, North America and Asia, OE-A supports its members with an effective networking and communication platform. OE-A thereby fosters international collaboration and promoting information exchange among all players along the value chain.

Europe

  • General Assembly / OE-A Meeting Europe (incl. board elections)
    March 18, 2019 (day before LOPEC), Munich (DE)
    hosted by IBM Watson
     
  • OE-A Meeting Europe
    June 12-13, 2019, Barcelona (ES), hosted by IMB-CNM
    Special Topic: “Healthy Growth: Printed Electronics for Medicine and Wellbeing”
     
  • OE-A Meeting Europe
    October 28-29, 2019, Frankfurt (DE), hosted by VDMA
    Special Topic: “Expanding Dimensions: 3D Structural Electronics”

Asia

  • OE-A Meeting Asia
    October 22, 2019, (day before ICFPE), Hsinchu/Taipei (TW)
    co-hosted by ITRI & Merck

North America

  • OE-A networking event, Santa Clara, US
    November 19, 2019    , evening (tbc)
    (day before PE USA)


OE-A is cooperating together with North American industry associations and conferences in order to increase end-user involvement in the printed electronics industry. 
Upcoming OE-A meetings in the North America to be announced.